3D-PEIM 2026

The Sixth International Symposium on 3D Power Electronics Integration & Manufacturing (3D-PEIM) Tempe, AZ, USA November 16-19, 2026 Welcome to 3D-PEIM 2026! Experience the future of 3D Power Packaging at 3D-PEIM 2026, the premier symposium uniting world-class researchers, industry leaders, and innovators in heterogeneous integration. Hosted at the Arizona State University Skysong Complex, this year’s event pairs breakthrough technology with the sunshine and energy of Phoenix, Arizona. Get ready for our biggest program yet—featuring six visionary plenary speakers, nine focused technical sessions, expert-led tutorials, and exclusive lab tours. Topics span the full 3D-PEIM ecosystem, including advanced packaging and 3D integrated modules, thermal management, design modeling and simulation, reliability and failure analysis, power delivery and energy storage, and next-generation materials. Beyond the technical sessions, connect with the community through a high-impact poster session and industry partner showcases highlighting the latest innovations. Don’t miss the guided tour of ASU’s MacroTechnology Works, a cutting-edge facility with industry-scale Advanced Packaging capabilities including a 300 mm Fan-Out Wafer-Level Packaging pilot line. Just 15 minutes from Phoenix Sky Harbor International Airport, Skysong offers free parking and easy access to hotels in Tempe and Scottsdale. The symposium also provides an unforgettable off-site banquet at the world-renowned Desert Botanical Garden, where technology meets the beauty of the Sonoran Desert—complete with Southwestern cuisine and entertainment. We welcome you to Join us at 3D-PEIM 2026 and connect with the community shaping the future of 3D power electronics